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VOx Uncooled Infrared Detectors FPA Microbolometer For Thermal Camera Module
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VOx Uncooled Infrared Detectors,
Uncooled Infrared Detectors FPA,
LWIR 400x300 / 17μm VOx Uncooled Infrared Detector, FPA Microbolometer for Thermal Camera Module
GST417W is one of the Wafer Level Packing (WLP) VOx uncooled focal plane array detectors developed by Global Sensor Technology (GST). Its resolution is 400x300 with pixel size at 17μm.
Wafer level packaging (WLP) is a kind of smallest size of low cost packaging. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. From its manufacturing, packaging and delivery to the customer, the entire process is greatly reduced and the cycle is much shorter, which will cause lower costs.
GST417W uncooled LWIR Infrared sensor is widely used in almost all popular applications such as thermography, security monitoring, firefighting, autonomous driving, personal vision etc.
- Tiny Size: 18x16x2.8mm
- Light Weight: <1.5g
- Low Power Consumption
- Sharp Image Presentation
- A Variety of Applications
|Digital Output||Built-in 14 bits ADC|
|Thermal Response Time||<12ms|
|Operation Temperature||-40°C ~ +85°C|
The GST417W uncooled microbolometer detector is widely used in many areas, such as Thermography, Security & Monitoring, Outdoors, UAVs Payload, Epedemic Prevention, ADAS, Intelligent Hardware, Smart Building, Smart Home, AIoT etc.
1. What is infrared thermal imaging?
Infrared thermal imaging is a kind of method which utilizes infrared radiation and thermal energy to gather information about objects. It converts invisible infrared radiation into visible infrared thermal image with temperature distribution of the target surface. Different objects and even different parts of the same object have different radiation ability and infrared reflection strength.
2. What can infrared imaging be used for?
-Search & rescue
-Security & monitoring
3. What is thermal imaging module?
A thermal imaging module usually consists of an infrared detector, infrared lens and hardware electronics with software and algorithm embedded. It is the minimum unit of a thermal imaging device.