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Uncooled Infrared Detectors
Contact Person :
Wendy Wang
Phone Number :
+86 27 50185150
Vanadium Oxide Uncooled Thermal Camera Core with 640x512 Resolution and 12μm Pixel Pitch at 0.5W Power Consumption
| Place of Origin | Wuhan, Hubei Province, China |
|---|---|
| Brand Name | SensorMicro |
| Certification | ISO9001:2015; RoHS; Reach |
| Model Number | iTL612 Pro |
| Minimum Order Quantity | 1 Piece |
| Price | Negotiable |
| Payment Terms | T/T |
Product Details
| Resolution | 640x512 | Frame Rate | 25/30Hz/50Hz |
|---|---|---|---|
| Power Consumption | 0.5W | Typical NETD | ≤40mK |
| Spectral Range | 8~14μm | Pixel Pitch | 12μm |
| Highlight | Uncooled Drone Thermal Camera Core,Vanadium Oxide Drone Thermal Camera,Tiny Size Thermal Camera Core |
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Product Description
Vanadium Oxide Uncooled Thermal Camera Core Tiny Size 640x512/12μm 30Hz
Product Overview
The iTL612Pro ultra-miniature infrared camera core is equipped with a 640×512/12μm wafer-level detector and engineered with an ultra-compact design. With a cross-sectional footprint of just 17.3×17.3 mm and a total weight of only 13.7g, it redefines industry SWaP (Size, Weight, and Power) standards. While ensuring high-quality thermal imaging and supporting a variety of SDK configurations, it achieves extreme miniaturization of the core components, precisely addressing the demanding requirements of compact infrared systems in terms of structural load, system integration, and iterative development.
Main Features
- Unmatched Lightness and Minimal Load
- Ultra-Miniature Size: 17.3×17.3×23.4 mm (including 9.1 mm lens)
- Ultra-Lightweight: 13.7±0.5g (including 9.1 mm lens)
- Ultra-Low Power Consumption: As low as 0.5W
- Mainstream FPA with Clear Imaging
- 640x512 Resolution for widespread integration
- Enhanced Image Clarity: Multiple new-generation image algorithms for improved image quality
- Easy Development & Seamless Integration
- Multiple lens options available to suit various application scenarios
- Supports multiple image output interfaces: DVP8, LVDS, MIPI, USB 2.0, and BT.656
- RAW/YUV/Matrix-TEMP data output with serial port control
Product Specifications
| Model | iTL612Pro |
|---|---|
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤40mK |
| Image Processing | |
| Digital Frame Rate | 25/30Hz/50Hz |
| Start-up Time | ≤5s |
| Digital Video | RAW/YUV/Matrix-TEMP |
| Image Algorithm | NUC/3DNR/DNS/DRC/EE |
| Image Display | 10(Black Hot/White Hot/Pseudo Color) |
| PC Software | |
| Infrared Module | Module Control & Video Display |
| Electrical | |
| Standard External Interface | 30Pin_HRS interface: DF40C-30DP-0.4V(51) |
| MIPI External Interface | 34Pin_Panasonic Connector Interface: AXE634124 |
| Communication Interface | TTL-232/USB2.0 |
| Digital Video Interface | DVP8/LVDS/MIPI/USB2.0/BT.656 |
| Supply Voltage | 4.2-5.5V |
| Typical Power Consumption | 0.5W |
| Temperature Measurement | |
| Operating Temperature | -10℃~+50℃ |
| Temperature Measurement Range | / |
| Temperature Measurement Accuracy | / |
| Partial Temperature Measurement | / |
| SDK | / |
| Mechanical | |
| Size (including lens) | 17.3×17.3×23.4 (9.1mm lens) 17.3×17.3×30.2 (13mm lens) 17.3×17.3×38 (25mm lens) 17.3×17.3×54 (45mm lens) |
| Weight (including lens) | 13.7±0.5g (9.1mm lens) 20±0.5g (13mm lens) 27.3±0.5g (25mm lens) 51±0.5g (45mm lens) |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | Sine Vibration, Frequency: 10HZ～150HZ～10HZ, Peak Value: 0.15mm, Axial Direction: X, Endurance Time: 8min/axis, Cycles: 2 times |
| Impact | Half Sine Wave, 30g/11ms, Impact Direction X Axis, 3 times |
| Certification | ROHS2.0/REACH |
| Optical Lens | Fixed Focus Athermal: 9.1/13/25/45mm |
Industrial Applications
The iTL612 Pro thermal imaging module can be used in fields of Forest Firefighting, Power Maintenance, Photovoltaic Inspection, Security Monitoring, Wearable Devices, Portable Devices etc.
Our Product Line
- High sensitivity and excellent performance
- World-leading technology in infrared industry
- Various infrared detectors available - both uncooled and cooled IR detectors in different formats and pixel size
- Volume production to ensure fast delivery - three production lines with annual production capability up to millions of detectors
Frequently Asked Questions
1. About ceramic packaging infrared detector
Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.
2. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing. It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.
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