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Thermal Camera Core
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Thermal Security Camera
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Plug-in Thermal Camera
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Cooled Infrared Detectors
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Cooled Camera Modules
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Optical Gas Imaging
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Radiometric Thermal Module
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High Resolution Thermal Camera Module
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Thermal Camera For Fever Detection
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Vehicle Mounted Thermal Camera
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Integrated Dewar Cooler Assembly
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Uncooled Infrared Detectors
Uncooled Thermal Camera Module with 640x512 Resolution Low Power Consumption 0.7W and Compact Size 22.2×22.2×23.9mm
| Resolution | 640x512 /8μm | NETD | ≤30mK |
|---|---|---|---|
| Spectral Range | 8~14μm | Size (mm) | 22.2×22.2×23.9 (With 6mm Lens) |
| Digital Video | USB /MIPI | Analog Video | PAL(default) / NTSC |
| Highlight | IP67 Uncooled Thermal Camera Module,Intelligent Image Algorithm Thermal Camera Module,VOx Thermal Security Camera |
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LWIR Uncooled Thermal Camera Module for Thermal Security Camera
COIN417G2 uncooled infrared module is a new generation version of COIN417 developed by SensorMicro. It integrates 400x300@17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm. There are three types of lenses for COIN417G2 Thermal Module: fixed athermal 9.1㎜/13㎜/19㎜ lenses for different observation distances.
By using the WLP infrared detector and optimizing for SWaP (Size, Weight, and Power), the typical power consumption of COIN417G2 has been reduced by 50%, from 1.4W to 0.7W, while maintaining performance. Startup time is significantly reduced from 10s to 3.5s. The module guarantees IP67 protection level and passes ESD testing: contact discharge ±4KV, air discharge ±8KV.
The COIN417G2 infrared module features sharp, crisp thermal imaging, compact size, and low cost. It includes an optional thermographic function with measurement range from -20℃ to 550℃ for industrial temperature measurement (supports customization and expansion).
COIN417G2 thermal module meets remote temperature measurement requirements and can be integrated into various thermal cameras.
- Equipped with ApexCore 640×512/8μm infrared detector, delivering clear thermal imaging with outstanding cost-performance
- Integrated with a dedicated ASIC chip for high energy efficiency
- Sectional dimension: only 22.2×22.2×23.9mm (including a 6mm lens)
- Weighing just 17±1.5g
- Low power consumption: 680mW
- Native analog video or digital video output, supporting both CVBS/USB/MIPI standards—no additional development required
- Easy mounting with minimal structural design effort
| Model | MICO608 |
|---|---|
| IR Detector | |
| Sensitive Material | VOx |
| Resolution | 640×512 |
| Pixel Size | 8µm |
| NETD | ≤30mK/F1.0/25℃ |
| Spectral Response | 8~14μm |
| Optical Lens | |
| Focus/F# | 3.2/F1.0 | 6mm/F1.0 | 8.7mm/F1.0 |
| FOV | 91°(H)×73°(V) | 47.7°(H)×38.2°(V) | 33°(H)×26°(V) |
| Detection Range (8 pixels) | 99m (5'11" tall person) 360m (4m×3m vehicle) |
| Type | Fixed Focus Athermal |
| First lens sealing/coating | IP67 |
| Image Processing | |
| Analog Video | PAL(default) / NTSC |
| Digital Video | USB / MIPI |
| Frame Rate | 25Hz/30Hz |
| Start-up Time | ≤6s |
| Image Algorithm | NUC/DRC/DNS/DDE/SFFC |
| Pseudo Color | 11 types - customizable |
| Electrical Interface | |
| Standard External Interface | 3PIN interface (A1251-WV-S-3P) | 9PIN interface(A1251-WV-S-9P) | 26PIN interface(DF56C-26S-0.3V-51) |
| Video Interface | CVBS | USB | MIPI |
| Power Supply | |
| Supply Voltage | DC: 5V~24V |
| Steady Power Consumption | ≤680mW@5V, 23±3℃ |
| Mechanical | |
| Size | 22.2mm×22.2mm×23.9mm (including a 6mm lens) |
| Weight | 17±1.5g |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | Random Vibration, 5.35grms, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, 3 Axis, 6 Direction |
| Certification | RoHS2.0/Reach |
The MICO608 thermal module can be used in Thermography, Security Monitoring, Firefighting & Rescue, Outdoors, AIoT, Smart Hardware, ADAS, and more.
A wide range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.
Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.
Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.
Multiple interface options make integration straightforward and enable rapid development across multiple application fields.

