VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

VOx Uncooled LWIR 1280x1024 / 12μm Thermal Camera Module for Industrial Temperature Measurement

PLUG1212R is one of the PLUG-R series uncooled infrared camera module developed by Global Sensor Technology (GST). It adopts the market preferred focal plane array VOx microbolometer uncooled infrared detector, professional signal processing circuit and image processing platform, completely transforms the target infrared radiation into temperature data. Its temperature measurement is available and temperature range can be customizable raging from -20℃~150 ℃ for industrial temperature measurement.

With large array 1280x1024 resolution, the PLUG1212R uncooled thermal module could present more image details and supports larger field of view. The reduced 12µm pixel size offer better spatial resolution and match shorter optical lens focus to achieve the same range mission.

- Pixel pitch: 12μm

- Resolution: 1280x1024

- Spectra Range: 8μm -14μm

- High Sensitivity: NETD<30mK

- Temperature Range: -20℃~150℃, 100℃~550℃

- Temperature Accuracy: ±2℃ or ±2%

- High reliability & Strong Environmental Adaptability.

The PLU1212R infrared imaging module is widely used in Power Electricity, Machine Vision, Building Inspection, Metallurgical Petrochemical etc.

1. About ceramic packaging infrared detector

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.

2. Wafer Level Packaging

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.

It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.