400x300 17μm Compact COIN Series Uncooled Thermal Camera Core

Place of Origin Wuhan, Hubei Province, China
Brand Name GST
Certification ISO9001:2015; RoHS; Reach
Model Number COIN417/R
Minimum Order Quantity 1 Piece
Price Negotiable
Payment Terms L/C, T/T

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Product Details
Resolution 400x300/17μm Temperature -20℃~+150℃ (Customizable)
NETD <40mK Spectral Range 8~14μm
Size 25.4x25.4x14.1 (With Shutter) Weight 13g±0.5g (Without Lens)
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400x300 Compact Thermal Camera


Compact Thermal Camera Core Uncooled

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Product Description
COIN417/R Infrared Camera Module


Compact Design 400x300 / 17μm COIN Series Uncooled LWIR Thermal Imaging Camera Module


Product Description


COIN417/R uncooled infrared module uses the fully optimized SWaP-C wafer level package (WLP) infrared imaging detector with 400x300 resolution and 17μm pixel size. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.


Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.


The COIN417/R infrared module features in sharp and crisp thermal image presentation, compact size and low cost. Its lightweight and flexible features with various industry standard interfaces make it popular in infrared applications such as Security & Surveillance, UAV Payloads, Advanced Driver Assistant System, Firefighting, AIoT etc.


Main Features


- Compact, flexible structure

- Low power consumption

- Easy integration into terminal products

- Shorten secondary development cycle


Product Specifications


Model COIN417/R
IR Detector Performance
Resolution 400x300
Pixel Pitch 17μm
Spectral Range 8~14μm
NETD <40mk
Image Processing
Frame Rate 25Hz/30Hz/50Hz/60Hz
Start-up Time ≤10s
Analog Video PAL/NTSC
Digital Video RAW/YUV/BT656
Dimming Mode Linear/Histogram/Mixed
Digital Zoom 1~8X Continual Zoom, Step Size 1/8
Image Display Black Hot/White Hot/Pseudo Color
Image Direction Horizontally/Vertically/Diagonally Flip
Image Algorithm NUC/AGC/IDE/DNR
Electrical Specification
Standard External Interface 30pin_HRS
Communication Mode RS232-TTL, 115200bps
Supply Voltage 3.5~5.5V
Typical Power Consumption <1.1W
Temperature Measurement
Operating Temperature Range -10°C~50°C
Temperature Measurement Range -20°C~150°C, 100°C~550°C
Temperature Accuracy ±3℃ or ±3% (Take the Maximum Value)
SDK Support ARM/Windows/Linux SDK, Full Screen Thermography
Physical Characteristics
Dimension (mm) 25.4x25.4x14.1 (With Shutter)
Weight 13g±0.5g (Without Lens)
Environmental Adaptation
Operation Temperature -40°C ~ +70°C
Storage Temperature -45°C ~ +85°C
Humidity 5%~95%, Non-condensing
Vibration Random Vibration 5.35grms, 3 Axis
Shock Half-sine Wave, 40g/11ms, 3 Axis 6 Direction
Optional Lens Fixed Focus Athermal: 9.7mm/15mm/19mm


Industrial Applications


The COIN417/R IR camera module is widely used in Thermography, Security & Monitoring, Outdoors, Firefighting & Rescue, AIoT, Intelligent Hardware, UAV Payloads, ADAS etc.


400x300 17μm Compact COIN Series Uncooled Thermal Camera Core 0


GST Infrared Team


400x300 17μm Compact COIN Series Uncooled Thermal Camera Core 1




1. What is infrared thermal imaging?

Infrared thermal imaging is a kind of method which utilizes infrared radiation and thermal energy to gather information about objects. It converts invisible infrared radiation into visible infrared thermal image with temperature distribution of the target surface. Different objects and even different parts of the same object have different radiation ability and infrared reflection strength.


2. What can infrared imaging be used for?

-Night vision

-Search & rescue

-Non-destructive test

-Epidemic prevention


-Security & monitoring



3. What is thermal imaging module?

A thermal imaging module usually consists of an infrared detector, infrared lens and hardware electronics with software and algorithm embedded. It is the minimum unit of a thermal imaging device.