Clear Image Infrared Thermal Camera Module Core 640x512 17μM For ADAS

Infrared Thermal Camera Module Core 640x512 / 17μM For Industrial Thermography

PLUG617R uncooled thermal camera module consists of 640x512 / 17μm uncooled fpa infrared detector, full series of optical components, professional signal processing circuit and image processing algorithm.

PLUG617R is a kind of uncooled camera module applied in the field of industrial thermal imaging and temperature measurement. The temperature range is customizable, which can meet the specific requirements of industrial thermography and present a clear thermal image.

As a leading thermal camera module manufacturers, Global Sensor technology is committed to opening a new vision for industrial temperature measurement. After years of technical accumulation and practical experience in the field of infrared temperature measurement, we have provided our customers a full range of machine thermal imaging vision solutions.

- NETD<30mk, High Sensitivity
- Stable Performance
- Easy Integration
- Clear Image Quality & Details
- Customizable Temperature Range
- Strong Environmental Adaptability

The PLUG617R thermal imaging module is widely used in Electric Power Inspection, Machine Vision, Building HVAC Security & Monitoring, Outdoors, Firefighting & Rescue, Law Enforcement & Rescue, ADAS, UAV Payloads etc.

1. About ceramic packaging infrared detector

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.

2. Wafer Level Packaging

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.

It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.