Industrial Thermography LWIR Thermal Camera Module Uncooled 400x300 17μm

400x300 17μM LWIR Thermal Camera Module Uncooled With Industrial Thermography

PLUG417R thermal camera core uses the 400x300 / 17μm uncooled LWIR infrared detctor with an optional temperature measurement function with measurement range from -20℃~150 ℃ for industrial or body temperature measurement. This infrared thermal module can not only measures the value of temperature around you but also display the thermal imaging figure. So it must be your best choice to monitor the temperature change. 

This small infrared camera module can be widely used in infrared thermal imaging applications such as Thermography, Electricity Power Inspection, Building Inspection etc. It is beneficial to OEM customers for secondary development and integration in all kinds of thermal imagers and infrared thermographic cameras.

- NETD<30mk, High Sensitivity
- Stable Performance
- Easy Integration
- Clear Image Quality & Details
- Customizable Temperature Range
- Strong Environmental Adaptability

The PLUG417R thermal camera core is widely used in Electric Power Inspection, Machine Vision, Building HVAC Security & Monitoring, Outdoors, Firefighting & Rescue, Law Enforcement & Rescue, ADAS, UAV Payloads etc.

A wide range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.

Rich Product Variety

Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.

Outstanding Performance

Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.

Easy Integration

Multiple interface options make integration straightforward and enable rapid development across multiple application fields.

1. Wafer Level Packaging

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing. It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.