LWIR Thermal Module 384x288 17um Infrared Detector For Medical Imaging System

 
LWIR Thermal Module 384x288 17um Infrared Detector For Medical Imaging System

iHA417W thermal module is specially developed for medical diagnosis. Integrated with the self-developed wafer level packaging 384×288/17μm infrared detector by Global Sensor Technology, the iHA417W medical diagnosis thermal module has smaller size, which guarantees a lower integration cost. It helps to develop medical and health markets at all levels faster, and lets thermal imaging technology benefit the public.

With typical NETD<50mk/f1.0/25℃, and temperature uniformity ≤±0.3℃ (better than the industry average of ±0.5℃), the overall thermal imaging uniformity of iHA417W thermal imaging module is better, and its temperature measurement function is more stable.

By using thermal imaging technology, doctors can carry out 100% safe, no radiation, non-invasive, non-contact full body checkup to avoid further, unnecessary testing procedures. The heat distribution in various parts of human body can be quickly shown to early detect and diagnose physical abnormalities, so that any further treatment can be easier and more effective.

 
- Small Size: 25.4mm×25.4mm×30.3mm (with lens)
- Typical NETD<50mk
- Detect Distance: 0.5m/5m
- Light Weight as Low as 32.2g
- Superior Temperature Measurement Accuracy: ±0.5℃

 
The iHA417 thermal module is expected to be widely used in the fields of Disease Screening, Traditional Chinese Medicine Physiotherapy, Health Check-up, Rehabilitation etc. at present and in the future.

1. About metal packaging infrared detector

Metal packaging uses metal tube shell, thermoelectric cooler (TEC) and columnar getter. The TEC plays an important role of stabilizing the working temperature so that the infrared detector works at room temperature, thereby improving the ability of thermal imaging sensors to adapt to extreme environments, such as heavy fog, rain and snow etc.

But the disadvantage is that the cost is too high, accounting for more than 60% of the total cost of the entire uncooled products production, and causing a long production cycle. Such packaging method is for high-end applications.

2. About ceramic packaging infrared detector

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.

3. Wafer Level Packaging

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.

It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.