Uncooled LWIR Thermal Imaging Module 640x512 12uM For UAV Payloads
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|Spectral Range||8~14μm||Pixel Pitch||12μm|
|Typical NETD||≤40mk||Frame Rate||30Hz|
Uncooled LWIR Thermal Imaging Module,
UAV Payloads Thermal Imaging Module,
640x512 Uncooled Thermal Camera Core
Uncooled LWIR 640x512 12μm Thermal Imaging Module for UAV Payloads
The iTL612R infrared camera core integrates 640x512 / 12μm wafer level package (WLP) infrared thermal detector. It is an uncooled LWIR radiometric thermal imaging module for drones with spectral range from 8 to 14μm.
iTL612 thermal camera module features in sharp and crisp image presentation, compact size and low cost. Oriented for fully optimized SWaP, iTL612R uncooled thermal module provides a reliable solution for infrared system integration with limited space. Its compact structure has reached top level of the same specification module. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
The iTL612 thermal module is specially developed for the field of Predictive Maintenance, Photovoltaic Inspection, Environmental Protection, Scientific Research, Aerial Photography, Police Investigation, Relief & Rescue, Forest Fire Prevention, Urban Safety etc.
Compact & Lightweight Design
• Size: 21mm×22.3mm×27.3mm (with 9.1mm lens)
• Weight: 20.8g±1.5g (with 9.1mm lens)
• Low power consumption as low as 0.7W
Clear Image & Accurate Radiometry
• Brand new image process algorithm: NUC/3DNR/DNS/DRC/EE
• Support Windows/Linux/ARM SDK
• Support regional, point & isotherm temperature measurement
Various Interfaces for Easy Integration
• DVP/LVDS/USB2.0 interfaces, RAW/YUV image data output, serial port control
|IR Detector Performance|
|Sensitive Material||Vanadium Oxide|
|Image Algorithm||Non-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
Dynamic Range Compression (DRC)
Edge Enhancement (EE)
|Image Display||Black Hot/White Hot/Pseudo Color|
|ICC Software||Module Control & Video Display|
|Standard External Interface||30Pin_HRS: DF40C-30DP-0.4V(51), (HRS, Male)|
|USB Expansion Board||Type-C|
|Digital Video Interface||CMOS8/USB2.0|
|Supply Voltage||3.3V±0.1V VDC|
|Typical Power Consumption||0.7W|
|Operating Temperature Range||-10°C~+50°C|
|Temperature Measurement Range||-20°C~+150°C, 0°C~550°C; Support Customization and Expansion|
|Temperature Measurement Accuracy||Greater of ±3°C or ±3% (@23℃±3℃)|
|Regional Temperature Measurement||Support Maximum, Minimum and Average Value of the Output Regional Temperature|
|SDK||Support Windows/Linux/ARM; Achieve Video Stream Analysis and Conversion from Gray to Temperature|
|Size (mm)||21×22.3×27.3 (With 9.1mm Lens)|
|Weight||20.8g±1.5g (With 9.1mm Lens)|
|Vibration||5.35grms, 3 Axis|
|Shock||Half-sine Wave, 40g/11ms, 3 Axis 6 Direction|
|Optional Lens||Fixed Focus Athermal: 9.1mm|
The iTL612/R thermal imaging module can be integrated into UAV payloads and wearable devices so that is widely used in fields of Predictive Maintenance, Photovoltaic Inspection, Environmental Protection, Scientific Research, Aerial Photography, Police Investigation, Relief & Rescue, Forest Fire Prevention, Urban Safety etc.
1. What is the advantage of infrared thermal imaging?
---See through total darkness
---Identification under camouflage
---Long range detection
---Heat distribution detection
---Non-contact temperature measurement
---And so on
2. What is thermal sensiivity?
Thermal Sensitivity, also named NETD (Noise Equivalent Temperature Difference), is a key parameter for evaluating medium wave (MWIR) and long wave (LWIR) thermal imaging cameras. It is directly related to the clarity measured by the thermal imager. It is a numerical value representing the signal-to-noise ratio of the temperature difference and measured in milliKelvins (mK). The smaller the thermal sensitivity value, the higher the sensitivity and the clearer the image.
3. What is the difference between wafe level package, ceramic package and metal package?
Uncooled infrared detectors are currently divided into metal packaging, ceramic packaging, and wafer-level packaging. Metal packaging is the earliest and the best among the three main packaging forms; wafer-level packaging is suitable for mass production; and the ceramic packaging is more favored by the dedicated market for civilian products.