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WUHAN GLOBAL SENSOR TECHNOLOGY CO., LTD.
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Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring

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Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring

Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring
Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring
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Large Image :  Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring

Product Details:
Place of Origin: Wuhan, Hubei Province, China
Brand Name: GST
Certification: ISO9001:2015; RoHS; Reach
Model Number: TWIN612/R
Payment & Shipping Terms:
Minimum Order Quantity: 1 Piece
Price: Negotiable
Payment Terms: L/C, T/T
Detailed Product Description
Resolution: 640x512 Power Consumption: 0.8W
Spectral Range: 8~14μm Pixel Pitch: 12μm
NETD: <40mK Frame Rate: 25Hz/30Hz

TWIN612 Thermal Imaging Module  

 
Uncooled LWIR 640x512/ 12μm Thermal Camera Module with Clear Thermal Imaging 
 

Product Description

 

TWIN612 thermal module is a new arrival product developed by Global Sensor Technology. It integrates 640×512/12µm ceramic package uncooled infrared detector. With typical NETD<40mk, the TWIN612 thermal module could present clearer, sharper and more detailed image.

With temperature measurement range of -20℃~150℃/0~550℃, accuracy of ±2℃ or ±2% and frame rate up to 30Hz, the thermal module guarantees smooth thermal image and accurate temperature measurement.

 

The TWIN612 thermal module has the advantages of compact design, light weight structure and power consumption as low as 0.8w. With enhanced image algorithms and temperature measurement function, the TWIN612 thermal module presents more stable images and accurate temperature.

 

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. Thus, the TWIN612 thermal module could be applied to industries that have strict requirements on size, weight and power consumption.

 

Main Features

 

- Mini Size: 25.4mm×25.4mm×35mm
- Light Weight: 25g
- Typical NETD<40mk
- Sharp, Clear Thermal Imaging
- Typical Power Consumption as Low as 0.8W

 

Product Specifications

 

Model TWIN612/R
IR Detector Performance
Resolution 640×512
Pixel Size 12μm
Spectral Range 8~14μm
Typical NETD <40mK
Image Processing
Frame Rate 25Hz/30Hz
Start-up Time 6s
Analog Video PAL/NTSC
Digital Video YUV/BT.656/LVDS/USB2.0
Image Display 11 in Total (White Hot/Lava/Ironbow/Aqua/Hot Iron/Medical/Arctic/Rainbow1/Rainbow2/Red Hot/Black Hot)
Image Algorithm NUC/3D/2D/DRC/EE
Electrical Specifications
Standard External Interface 50pin_HRS
Communication Interface RS232/USB2.0
Supply Voltage 4~5.5V
Typical Power Consumption 0.8W
Temperature Measurement
Operating Temperature Range -10℃~50℃
Temperature Measurement Range -20℃~150℃, 0℃~550℃
Temperature Measurement Accuracy Greater of ±2℃ or ±2%
SDK Windows/Linux; Achieve Video Stream Analysis and Conversion from Gray to Temperature
Physical Characteristics
Dimension (mm) 25.4×25.4×35 (Without Lens)
Weight 25g (Without Lens)
Environmental Adaptability
Operating Temperature -40℃~+70℃
Storage Temperature -45℃~+85℃
Humidity 5%~95%, non-condensing
Vibration 5.35grms, 3 Axis
Shock Half Sine Wave, 40g/11ms, 3 Axis, 6 Direction
Optics
Optional Lens Fixed Athermal: 13mm

 

Industrial Applications

 
The TWIN612/R thermal imaging module is applied to the field of Thermography, Security Monitoring, UAV Payloads, Robots, Intelligent Hardware, ADAS, Firefighting & Rescue
 

Our Advantages

 
Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring 0
 

FAQs

 

1.What is infrared detector / thermal imaging sensor?

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.

 

2.What is WLP?

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.

 

3. What is the difference between wafe level package, ceramic package and metal package?

Uncooled infrared detectors are currently divided into metal packaging, ceramic packaging, and wafer-level packaging. Metal packaging is the earliest and the best among the three main packaging forms; wafer-level packaging is suitable for mass production; and the ceramic packaging is more favored by the dedicated market for civilian products.

Contact Details
WUHAN GLOBAL SENSOR TECHNOLOGY CO., LTD.

Contact Person: Sales Manager

Tel: +8613125195785

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