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Contact Person :
Wendy Wang
Phone Number :
+86 27 50185150
Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring
| Place of Origin | China |
|---|---|
| Brand Name | SensorMicro |
| Certification | ISO9001:2015; RoHS; Reach |
| Model Number | COIN612RG2 |
| Minimum Order Quantity | 1 Piece |
| Price | Negotiable |
| Payment Terms | T/T |
Product Details
| Resolution | 640x512 | Power Consumption | 0.65W |
|---|---|---|---|
| Spectral Range | 8~14μm | Pixel Pitch | 12μm |
| NETD | ≤25mK/F1.0/25℃ | Frame Rate | 25Hz/30Hz |
| Highlight | Long Wave 12um Thermal Imaging Module,Monitoring Thermal Imaging Module 640x512 |
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Product Description
Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring
Product Overview
The COIN612RG2 infrared camera core delivers high-precision industrial detection and fine temperature monitoring. Utilizing ApexCore 640*512/12μm high-resolution infrared detector technology, it achieves exceptional thermal imaging sensitivity with NETD≤25mK and precise temperature difference identification. Enhanced by optimized temperature measurement algorithms and high-precision signal processing, it provides ultra-stable real-time temperature detection with accuracy of ±2°C or ±2%.
Main Features
- Comprehensive Functionality: ApexCore wafer-level infrared detector with NETD≤25mK, advanced image processing algorithms, temperature measurement accuracy up to ±2°C or ±2%
- Compact Design: Dimensions: 25.4*25.4*15.7mm, Weight: 15±1g, Power consumption: ≤0.65W
- Flexible Integration: Multiple optical lens options, supports USB2.0/DVP/LVDS/BT.656 interfaces, RAW/YUV/TMP data output with serial port control
Product Specifications
| Model | COIN612RG2 |
|---|---|
| IR Detectors | Sensitive Material: VOx Resolution: 640*512 Pixel Size: 12μm Spectral Response: 8μm ~ 14μm Typical NETD: ≤25mK/F1.0/25℃ |
| Image Processing | Digital Frame Rate: 25/30Hz Start-up Time: 6s Analog Video: PAL/NTSC Digital Video: RAW/YUV422/TMP Image Algorithms: Non-uniformity Correction, 3D Noise Reduction, 2D Noise Suppression, Dynamic Range Compression, Edge Enhancement Image Display: 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| Electrical | Standard External Interface: 50pin DF40C-50DP-0.4V(51) USB Expansion Board: USB3.0/USB2.0/VPC/USB2.0&VPC Communication Interface: TTL-232/USB2.0 Digital Video Interface: DVP8/DVP16/USB2.0/BT.656/LVDS Supply Voltage: 4.5~5.5V Typical Power Consumption: 0.65W |
| Temperature Measurement | Operating Temperature: -10℃~+50℃ Temperature Measurement Range: -20℃~150℃, 100℃~550℃; Support Customization and Expansion Temperature Measurement Accuracy: ±2°C or ±2% (whichever is greater) Partial Temperature Measurement: Support output maximum, minimum and average value of temperature measurement areas SDK: Android/Windows/Linux |
| Mechanical | Bare Core Size: 25.4*25.4*15.7mm Bare Core Weight: 15±1g |
| Environmental | Operating Temperature: -40℃~+70℃ Storage Temperature: -45℃~+85℃ Humidity: 5%~95%, non-condensing Vibration: 5.35grms, Random Vibration, 3-axis Impact: Half Sine Wave, 40g/11ms, Impact Direction 3 Axis, 6 Direction Certification: ROHS2.0/REACH |
| Optical Lens | Fixed Focus Athermal: 4.8mm/7mm/9.1mm/13mm/19mm/25m/35mm Protection Level: IP67 (Front Lens) |
Industrial Applications
Thermography, Industrial Vision, Firefighting and Rescue, Security Surveillance, Outdoor Observation, Machine Vision, Consumer Electronics
Our Advantages
- Wide Product Range: Infrared detectors, camera cores, and modules to meet various integration requirements
- Rich Product Variety: Multiple array resolutions, pixel sizes, wavebands, and lens options for diverse applications
- Outstanding Performance: Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability
- Easy Integration: Multiple interface options for straightforward integration and rapid development
Frequently Asked Questions
- What is infrared detector / thermal imaging sensor?
Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device that reacts to infrared radiation and thermal energy, converting it into electrical signals and outputting visible thermal images. - What is WLP?
WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package and ceramic package, they are the three main package formats of uncooled infrared detectors. - What is the difference between wafer level package, ceramic package and metal package?
Uncooled infrared detectors are currently divided into metal packaging, ceramic packaging, and wafer-level packaging. Metal packaging is the earliest and offers the best performance; wafer-level packaging is suitable for mass production; and ceramic packaging is more favored by the dedicated market for civilian products.
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