Vanadium Oxide Uncooled Drone Thermal Camera Core Tiny Size 640x512 30Hz
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|Spectral Range||8~14μm||Pixel Pitch||12μm|
|Typical NETD||≤40mK||Frame Rate||30Hz|
Uncooled Drone Thermal Camera Core,
Vanadium Oxide Drone Thermal Camera,
Tiny Size Thermal Camera Core
Tiny Size Uncooled Infrared Camera Core 640x512 12um for UAV Payloads
As a leading manufacturer of cooled uncooled infrared detectors & thermal modules, Global Technology developes a tiny size and lightweight infrared thermal imaging core iTL612R Pro, which is the compact version of infrared camera core iTL612R.
Fully oriented for SWaP-C (size-weight-and- power-cost), the size and weight of iTL612R Pro infrared camera core has already been at the forefront in the industry.It is the best choice for customers who have restrict requirements on size and weight when integrating their own drones.
Providing 640×512/12μm self-developed wafer-level infrared detector, lens protection grade IP67, imaging and temperature measurement version, and various SDK solutions, the iTL612R Pro thermal module responds to space constraints with smaller size and lighter weight, achieves longer battery life with lower power consumption, overcomes integration problems in the consumer electronics field, and provides more solutions for compact and portable products.
It is specially developed for the field of Predictive Maintenance, Photovoltaic Inspection, Environmental Protection, Scientific Research, Aerial Photography, Police Investigation, Disaster Relief & Rescue, Forest Fire Prevention, Urban Safety etc.
Compact & Lightweight Design
• Size: 17mm×17mm×22mm (with 9.1mm lens)
• Weight: 13g (with 9.1mm lens)
• Power consumption as low as 0.7W
Clear Image & Accurate Radiometry
• Brand new image process algorithm: NUC/3DNR/DNS/DRC/EE
• Support Windows/Linux/ARM SDK
• Support regional, point & isotherm temperature measurement
Various Interfaces for Easy Integration
• DVP/LVDS/USB2.0 interfaces, RAW/YUV image data output, serial port control
|IR Detector Performance|
|Sensitive Material||Vanadium Oxide|
|Image Algorithm||Non-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
Dynamic Range Compression (DRC)
Edge Enhancement (EE)
|Image Display||Black Hot/White Hot/Pseudo Color|
|ICC Software||Module Control & Video Display|
|Standard External Interface||30Pin_HRS: DF40C-30DP-0.4V(51), (HRS, Male)|
|USB Expansion Board||Type-C|
|Digital Video Interface||CMOS8/USB2.0|
|Supply Voltage||4.0-5.0V V VDC|
|Typical Power Consumption||0.7W|
|Operating Temperature Range||-10°C~+50°C|
|Temperature Measurement Range||-20°C~+150°C, 0°C~550°C; Support Customization and Expansion|
|Temperature Measurement Accuracy||Greater of ±2°C or ±2% (@23℃±3℃)|
|Regional Temperature Measurement||Support Maximum, Minimum and Average Value of the Output Regional Temperature|
|SDK||Support Windows/Linux/ARM; Achieve Video Stream Analysis and Conversion from Gray to Temperature|
|Size (mm)||17×17×22 (With 9.1mm Lens)|
|Weight||13g (With 9.1mm Lens)|
|Vibration||5.35grms, 3 Axis|
|Shock||Half-sine Wave, 40g/11ms, 3 Axis 6 Direction|
|Optional Lens||Fixed Focus Athermal: 9.1mm|
The iTL612R Pro thermal imaging module can be integrated into UAV payloads and wearable devices so that is widely used in fields of Predictive Maintenance, Photovoltaic Inspection, Environmental Protection, Scientific Research, Aerial Photography, Police Investigation, Relief & Rescue, Forest Fire Prevention, Urban Safety etc.
1. About ceramic packaging infrared detector
Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.
2. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.
It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.