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Thermal Camera Core
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Thermal Security Camera
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Plug-in Thermal Camera
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Cooled Infrared Detectors
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Cooled Camera Modules
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Optical Gas Imaging
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Radiometric Thermal Module
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High Resolution Thermal Camera Module
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Thermal Camera For Fever Detection
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Vehicle Mounted Thermal Camera
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Integrated Dewar Cooler Assembly
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Uncooled Infrared Detectors
Fast Integration 640x512 Resolution Thermal Imaging Camera Module with 8μm Pixel Pitch and ±0.5°C Accuracy for Health Care
| Resolution | 640x512 | Power Consumption | 0.6W |
|---|---|---|---|
| Spectral Range | 8~14μm | Pixel Pitch | 8μm |
| Typical NETD | ≤30mK | Frame Rate | 25Hz |
| Highlight | 17um Thermal Imaging Camera Module,Thermal Imaging Camera Module 384x288,Fast Integration Thermal Camera Module |
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The iHA608W thermal imaging camera module utilizes an ApexCore 640×512/8μm infrared detector for medical-oriented non-contact temperature measurement with accuracy up to ±0.5°C. Featuring exclusive medical thermal processing algorithms, it generates detailed thermal images and reliable temperature data. Compact and lightweight with an 8-μm pixel design, the core includes Type-C video and USB2.0 interfaces with multi-platform SDK support. Ideal for medical diagnosis, health screening, and livestock temperature measurement.
- Precise temperature measurement and fine thermal imaging
- Non-contact body temperature measurement with accuracy up to ±0.5°C
- Medical-grade lens and dedicated algorithms for clear thermal visuals
- Light-weight compact embedded core
- 8-μm ApexCore infrared detector for miniaturized layout
- 21×21×31.5 mm dimensions, weight 25±2 g
- Effortless integration for developers
- Type-C + USB2.0 dual interfaces
- SDK for Windows, Android and Linux
| Model | iHA608W |
|---|---|
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 640×512 |
| Pixel Size | 8μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤30mK |
| Image Processing | |
| Digital Frame Rate | 25Hz |
| Start-up Time | ≤6s |
| Digital Video | RAW/YUV/TMP |
| Image Algorithm | NUC/3DNR/DNS/DRC/EE |
| Image Display | Medical/Pseudo Color |
| PC Software | |
| Computer Software | Module Control & Video Display |
| Temperature Measurement | |
| Operating Temperature | 10℃~+50℃ |
| Temperature Measurement Range | 32℃~+42℃ |
| Temperature Measurement Accuracy | ≤±0.5℃ (after 2-minute warm-up, ambient 23±3°C, target 32-42°C) |
| Measurement Distance | 0.5m-5 m; supports multi-distance temperature measurement via SDK |
| SDK | Support Windows/Android/Linux SDK, Realize Video Stream Analysis, Module Control, Comprehensive Array Temperature Measurement, Temperature Imaging, Temperature Window Setting, Multiple Integration |
| Electrical | |
| Standard External Interface | USB(TYPE-C) |
| Communication Interface | USB |
| Digital Video Interface | USB2.0 |
| Supply Voltage | 5V±0.5 |
| Typical Power Consumption | 0.6W |
| Optical Lens | |
| Focus Length | 4mm |
| Type of Lens | Fixed Focus Athermal |
| F/# | 1 |
| FOV(H×V) | 69.2°×55.4° |
| Mechanical | |
| Size (including lens) | 21mm×21mm×31.5mm (including 4mm lens) |
| Weight (including lens) | 25g±2 (including 4mm lens) |
| Environmental Adaptability | |
| Operating Temperature | -10℃~+50℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction, 3 Axis, 6 Direction |
| ESD | 6kV contact discharge; 8kV air discharge |
| Certification | |
| Environmental Certification | ROHS2.0/REACH |
The iHA608W thermal module is expected to be widely used in the fields of Disease Screening, Traditional Chinese Medicine Physiotherapy, Health Check-up, Rehabilitation, and related healthcare applications.
- Diverse Product Portfolio: A wide range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.
- Rich Product Variety: Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.
- Outstanding Performance: Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.
- Easy Integration: Multiple interface options make integration straightforward and enable rapid development across multiple application fields.
Metal packaging uses metal tube shell, thermoelectric cooler (TEC) and columnar getter. The TEC plays an important role in stabilizing the working temperature so that the infrared detector works at room temperature, thereby improving the ability of thermal imaging sensors to adapt to extreme environments, such as heavy fog, rain and snow.
The disadvantage is that the cost is too high, accounting for more than 60% of the total cost of the entire uncooled products production, and causing a long production cycle. This packaging method is designed for high-end applications.
Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.
It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.

