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Radiometric Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

  • Radiometric Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm
Place of Origin China
Brand Name SensorMicro
Certification ISO9001:2015; RoHS; Reach
Model Number COIN1212R
Minimum Order Quantity 1 Piece
Price Negotiable
Payment Terms T/T
Product Details
Resolution 1280x1024/12μm NETD ≤40mK/F1.0/25℃
Spectral Range 8~14μm Digital Frame Rate 30Hz
Typical Power Consumption 1.0W Supply Voltage 4.5~5.5V
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VOx Thermal Camera Module 12um

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LWIR Thermal Camera Module 1280x1024

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VOx LWIR Camera Module
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Product Description
Radiometric Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

The COIN1212R infrared camera core features a megapixel 1280*1024/12μm uncooled infrared detector, integrated with advanced signal processing circuits and temperature measurement algorithms. It supports widely adopted serial communication protocols and offers a variety of video output interfaces along with a full range of optical lens options. Capable of quickly detecting temperature differences and delivering clear thermal images and precise temperature data, it significantly streamlines secondary development of temperature measurement systems. This makes it an all-in-one thermal imaging integration solution for applications in intelligent monitoring, high-end manufacturing, process control, scientific research, and other high-end thermal imaging applications.

Main Features
  • High-Definition Imaging, Precise Detection
    • Megapixel high-definition detection enables infrared temperature measurement over wider views and larger areas
    • When monitoring tiny temperature variations, more thermal details of the target are clearly revealed
  • Full-Featured and Efficient
    • Developed with a top-tier large-format uncooled infrared detector
    • Integrated with multiple advanced image processing algorithms to enhance image quality
    • Temperature measurement accuracy up to ±3°C or ±3%, supporting -20°C to 150°C and 0 to 550°C ranges, with customizable extensions
  • Multiple Configurations, Rapid Integration
    • Supports various image output modes including DVP and BT.1120
    • RAW/YUV image data output with serial port control
Product Specifications
Model COIN1212R
IR Detectors Indicators
Sensitive Material VOx
Resolution 1280*1024
Pixel Size 12μm
Spectral Response 8μm ~ 14μm
Typical NETD ≤40mK/F1.0/25℃
Image Processing
Digital Frame Rate 30Hz
Start-up Time 6s
Analog Video /
Digital Video RAW/YUV422/TMP
Image Algorithm Non-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
2D Noise Suppression (DNS)
Dynamic Range Compression (DRC)
Edge Enhancement (EE)
Image Display 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot)
PC Software
ICC Software Module Control & Video Display
Electrical
Standard External Interface 50pin: DF40C-50DP-0.4V(51), (HRS,Male)
Extension Board USB3.0
Communication Interface TTL-232
Digital Video Interface DVP16/BT.1120/MIPI
Supply Voltage 4.5~5.5V
Typical Power Consumption 1.0W
Temperature Measurement
Operating Temperature -10℃~+50℃
Temperature Measurement Range -20℃~150℃, 0℃~550℃; Support Customization and Expansion
Temperature Measurement Accuracy Greater of ±2℃ / ±2%
Partial Temperature Measurement Support output maximum, minimum and average value of temperature measurement areas
SDK Android/Windows/Linux; Achieve Video Stream Analysis and Conversion from Gray to Temperature
Mechanical
Bare Core Size(mm) 14mm/19mm/25mm: 25.4mm*25.4mm*19.3mm
35mm/50mm/100m: 35.4mm*35.4mm*17.8mm
Bare Core Weight(g) 14mm/19mm/25mm: 19.7±1g
35mm/50mm/100m: 32.5±1g
Environmental Adaptability
Operating Temperature -40℃~+70℃
Storage Temperature -45℃~+85℃
Humidity 5%~95%, non-condensing
Vibration 5.35grms, Random Vibration, 3-axis
Impact Half Sine Wave, 40g/11ms, Impact Direction 3 Axis, 6 Direction
Certification ROHS2.0/REACH
Optical Lens
Optical Lens Fixed Focus Athermal: 14mm/19mm/24mm
Protection Level IP67(Front Lens)
Industrial Applications

The COIN1212R infrared imaging module is widely used in Power Electricity, Machine Vision, Building Inspection, Metallurgical Petrochemical etc.

Standardized Service
  • Complete Documentation: Product manuals, setup guides, and selection references. Get started without guesswork.
  • Development & Testing Assistance: Sample Integrated Testing, performance evaluation, and parameter verification made easy.
  • Advanced Developer Toolkit: SDKs, APIs, algorithms, and debugging tools for deep integration.
  • Remote Technical Support: 24/7 support--quick response and timely resolution for critical issues.
  • Warranty: Original parts and strict process adherence to restore optimal performance.
FAQs
1. About ceramic packaging infrared detector
Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.
2. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing. It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.
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