384x288 Resolution 12μm Pixel Pitch LWIR Thermal Camera Module for Security and Rescue

Place of Origin Wuhan, Hubei Province, China
Brand Name SensorMicro
Certification ISO9001:2015; RoHS; Reach
Model Number iSE412
Minimum Order Quantity 1 Piece
Price Negotiable
Payment Terms T/T
Product Details
Spectral Range 8~14μm NETD <30mK
Resolution 384x288 / 12μm Frame Rate 50Hz
Start-up Time 6s Image Algorithm NUC/DRC/DNS/DDE/SFFC
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Product Description
384x288 12μm LWIR Thermal Camera Module Uncooled for Security and Rescue
Product Overview

Powered by a 384×288 resolution, 12μm pixel pitch ceramic-packaged thermal detector, the iSE412 infrared camera core achieves superior performance with optimized structural and algorithm design. Its innovative shutterless operation architecture eliminates frequent shutter calibration, effectively suppressing frame stuttering and background noise to realize ultra-smooth real-time imaging. Equipped with advanced image processing technologies such as super-resolution reconstruction and electronic zoom, alongside one-click calibration and customizable OSD functions, the module guarantees clear and adjustable imaging effects. Compatible with diverse lenses, extension components and Micro OLED displays, it supports flexible system customization. With small dimensions and lightweight design, the core maintains stable and reliable detection output under extreme spatial and environmental constraints, catering to high-precision industrial, security and rescue scenario demands.

Main Features
  • Shutterless Design for Smoother Viewing
    • No shutter calibration required during operation, eliminating image stuttering common in traditional shutter-based systems
    • Silent operation ensures discreet use without mechanical noise
  • Compact and Lightweight, Flexible for Integration
    • Total system dimensions as small as 25.4×25.4×22.7 mm, bare core weight ≤26±1.5g
    • Space-saving structural design allows flexible system layout and integration
  • Feature-Rich, Seamless Integration
    • Supports super-resolution algorithms, picture-in-picture, customizable OSD, sleep mode, one-click calibration, and compatibility with various Micro OLED displays
    • Compatible with multiple optical lenses and extension components for easy secondary development and system customization
Product Specifications
Model iSE412
IR Detectors Indicators
Sensitive Material VOx
Resolution 384×288
Pixel Size 12μm
Spectral Response 8μm ~ 14μm
Typical NETD ≤30mK
Image Processing
Effective Pixels 384×288
Digital Frame Rate 50Hz
Start-up Time 6s
Digital Video YUV420/YUV422/RGB888/RAW
Image Algorithm NUC/DRC/DNS/DDE/SFFC
Shutterless Supported
Image Display 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot)
Image Direction Horizontal/Vertical/Diagonal
Digital Zoom 1x/2x/4x/8x
Image Brightness Auto/Manual
Image Contrast Auto/Manual
Compensation Mode Manual
Electrical
Standard External Interface
50pin: BP040SB-50-0114-B-R0
Communication Interface TTL-232/USB2.0
Digital Video Interface DVP8/BT.656/DVP16/BT.1120/USB2.0/MIPI-DSI-4LANE
Extension Components USB2.0/SDI/HDMI/GIGE/Cameralink/VPC/MIPI-CSI-2LANE
Electrical Interface
Supply Voltage 2.7V~5.3V
Typical Power Consumption 0.8W@50Hz@23±3℃
Mechanical/Lens
Bare Core Size(mm) 25.4×25.4×22.7 φ36×24.3
Bare Core Weight(g) 26±1.5 28±1.5
Optical Lens
Fixed Focus Athermal: 4.9/9.1/13/19mm
Fixed Focus Athermal: 25mm/35mm
Shutter Components Optional
Vibration 5.35g, Random Vibration, 3-axis
Impact Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times 1500g@0.4ms
Protection Level IP67(Front Lens)
Environmental Adaptability
Operating Temperature -40℃~+70℃
Storage Temperature -45℃~+85℃
Humidity 5%~95%, non-condensing
Certification ROHS2.0/REACH
Industrial Applications

The iSE412 thermal camera core is widely used in Industrial Vision, Firefighting and Rescue, Security Surveillance, Outdoor Observation, Machine Vision, Consumer Electronics etc.

Product Advantages
Diverse Product Portfolio

A wide range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.

Rich Product Variety

Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.

Outstanding Performance

Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.

Easy Integration

Multiple interface options make integration straightforward and enable rapid development across multiple application fields.

Frequently Asked Questions
1. Wafer Level Packaging

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing. It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.