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Thermal Camera Core
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Thermal Security Camera
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Drone Thermal Camera
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Plug-in Thermal Camera
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Cooled Infrared Detectors
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Cooled Camera Modules
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Optical Gas Imaging
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Infrared Thermal Camera Module
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High Resolution Thermal Camera Module
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Thermal Camera For Fever Detection
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Vehicle Mounted Thermal Camera
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Integrated Dewar Cooler Assembly
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Uncooled Infrared Detectors
384x288 Resolution 12μm Pixel Pitch LWIR Thermal Camera Module for Security and Rescue
| Spectral Range | 8~14μm | NETD | <30mK |
|---|---|---|---|
| Resolution | 384x288 / 12μm | Frame Rate | 50Hz |
| Start-up Time | 6s | Image Algorithm | NUC/DRC/DNS/DDE/SFFC |
| Highlight | 17uM LWIR Thermal Camera Module,Industrial Thermography Thermal Camera Module,400x300 LWIR Thermal Camera |
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Powered by a 384×288 resolution, 12μm pixel pitch ceramic-packaged thermal detector, the iSE412 infrared camera core achieves superior performance with optimized structural and algorithm design. Its innovative shutterless operation architecture eliminates frequent shutter calibration, effectively suppressing frame stuttering and background noise to realize ultra-smooth real-time imaging. Equipped with advanced image processing technologies such as super-resolution reconstruction and electronic zoom, alongside one-click calibration and customizable OSD functions, the module guarantees clear and adjustable imaging effects. Compatible with diverse lenses, extension components and Micro OLED displays, it supports flexible system customization. With small dimensions and lightweight design, the core maintains stable and reliable detection output under extreme spatial and environmental constraints, catering to high-precision industrial, security and rescue scenario demands.
- Shutterless Design for Smoother Viewing
• No shutter calibration required during operation, eliminating image stuttering common in traditional shutter-based systems
• Silent operation ensures discreet use without mechanical noise - Compact and Lightweight, Flexible for Integration
• Total system dimensions as small as 25.4×25.4×22.7 mm, bare core weight ≤26±1.5g
• Space-saving structural design allows flexible system layout and integration - Feature-Rich, Seamless Integration
• Supports super-resolution algorithms, picture-in-picture, customizable OSD, sleep mode, one-click calibration, and compatibility with various Micro OLED displays
• Compatible with multiple optical lenses and extension components for easy secondary development and system customization
| Model | iSE412 | |
| IR Detectors Indicators | ||
| Sensitive Material | VOx | |
| Resolution | 384×288 | |
| Pixel Size | 12μm | |
| Spectral Response | 8μm ~ 14μm | |
| Typical NETD | ≤30mK | |
| Image Processing | ||
| Effective Pixels | 384×288 | |
| Digital Frame Rate | 50Hz | |
| Start-up Time | 6s | |
| Digital Video | YUV420/YUV422/RGB888/RAW | |
| Image Algorithm | NUC/DRC/DNS/DDE/SFFC | |
| Shutterless | Supported | |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) | |
| Image Direction | Horizontal/Vertical/Diagonal | |
| Digital Zoom | 1x/2x/4x/8x | |
| Image Brightness | Auto/Manual | |
| Image Contrast | Auto/Manual | |
| Compensation Mode | Manual | |
| Electrical | ||
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Standard External Interface
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50pin: BP040SB-50-0114-B-R0
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| Communication Interface | TTL-232/USB2.0 | |
| Digital Video Interface | DVP8/BT.656/DVP16/BT.1120/USB2.0/MIPI-DSI-4LANE | |
| Extension Components | USB2.0/SDI/HDMI/GIGE/Cameralink/VPC/MIPI-CSI-2LANE | |
| Electrical Interface | ||
| Supply Voltage | 2.7V~5.3V | |
| Typical Power Consumption | 0.8W@50Hz@23±3℃ | |
| Mechanical/Lens | ||
| Bare Core Size(mm) | 25.4×25.4×22.7 | φ36×24.3 |
| Bare Core Weight(g) | 26±1.5 | 28±1.5 |
| Optical Lens |
Fixed Focus Athermal: 4.9/9.1/13/19mm
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Fixed Focus Athermal: 25mm/35mm
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| Shutter Components | Optional | |
| Vibration | 5.35g, Random Vibration, 3-axis | |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times | 1500g@0.4ms |
| Protection Level | IP67(Front Lens) | |
| Environmental Adaptability | ||
| Operating Temperature | -40℃~+70℃ | |
| Storage Temperature | -45℃~+85℃ | |
| Humidity | 5%~95%, non-condensing | |
| Certification | ROHS2.0/REACH | |
The iSE412 thermal camera core is widely used in Industrial Vision, Firefighting and Rescue, Security Surveillance, Outdoor Observation, Machine Vision, Consumer Electronics etc.
A wide range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.
Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.
Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.
Multiple interface options make integration straightforward and enable rapid development across multiple application fields.
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing. It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.

