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Thermal Camera Core
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Thermal Security Camera
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Plug-in Thermal Camera
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Cooled Infrared Detectors
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Cooled Camera Modules
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Optical Gas Imaging
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Radiometric Thermal Module
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High Resolution Thermal Camera Module
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Thermal Camera For Fever Detection
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Vehicle Mounted Thermal Camera
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Integrated Dewar Cooler Assembly
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Uncooled Infrared Detectors
SWaP-C LWIR 1280x1024 Resolution Thermal Camera Module with 8μm Pixel Pitch and ≤30mK NETD for Portable Devices
| Resolution | 1280x1024 | Power Consumption | 1W |
|---|---|---|---|
| Spectral Range | 8~14μm | Pixel Pitch | 8μm |
| Typical NETD | ≤30mK | Frame Rate | 25/30Hz |
| Highlight | SWaP-C LWIR Thermal Camera Module,Drones LWIR Thermal Camera Module,Drones Thermal Camera Core 12uM |
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The iTL1208 thermal imaging module is a next-generation uncooled megapixel infrared camera core engineered for low-SWaP mobile system deployment, combining miniaturized hardware with high-precision thermal detection capabilities.
This infrared camera module delivers premium imaging performance with 8μm small pixel pitch, 1280×1024 megapixel resolution, and ≤30mK typical NETD for ultra-sensitive thermal detection.
Ideal for firefighting, industrial diagnostics, outdoor surveillance, and portable mobile thermal devices.
- Extreme Lightweight Design - Compact size of 22.6×22.6×34.5mm and weight of 35.7g (including 12mm lens) with among the highest levels of integration in its class
- High Sensitivity, Precise Detection - 8μm ultra-small pixel size with 1280×1024 resolution delivering fine detail and clear images, with typical NETD ≤ 30mK for reliable detection of subtle temperature differences
- Simplified Development, Fast Integration - Multiple optical lens options, supports MIPI CSI image output interface, RAW and YUV image data output with control via serial port/I2C
| Model | iTL1208 |
|---|---|
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 1280×1024 |
| Pixel Size | 8μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤30mK |
| Image Processing | |
| Digital Frame Rate | 25/30Hz |
| Start-up Time | ≤6s |
| Digital Video | RAW/YUV |
| Image Algorithm | NUC/3DNR/DNS/DRC/EE |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| PC Software | Module Control & Video Display |
| Electrical | |
| Standard External Interface | 34Pin_Connector Interface: BP04SD-34-0065-R0 |
| Communication Interface | TTL-232/I2C |
| Digital Video Interface | MIPI-CSI |
| Supply Voltage | 4.5-5.5V |
| Typical Power Consumption | 1W |
| Mechanical | |
| Size (including lens) |
With 5mm lens: 22.6mm×22.6mm×50mm (lens outer diameter Φ37mm) With 10mm lens: 22.6mm×22.6mm×45.3mm (lens outer diameter Φ33mm) With 12mm lens: 22.6mm×22.6mm×34.5mm (lens outer diameter Φ26.6mm) With 17mm lens: 22.6mm×22.6mm×35.4mm (lens outer diameter Φ27mm) With 25mm lens: 22.6mm×22.6mm×44.2mm (lens outer diameter Φ33mm) With 35mm lens: 22.6mm×22.6mm×50.9mm (lens outer diameter Φ43.2mm) |
| Weight (including lens) |
85.5±4.5g (With 5mm Lens) 70.5±3.6g (With 10mm Lens) 35.7±2g (With 12mm Lens) 40.7±2.1g (With 17mm Lens) 71.0±3.6g (With 25mm Lens) 110±5.5g (With 35mm Lens) |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times |
| Certification | ROHS2.0/REACH |
| Optical Lens | Fixed Focus Athermal: 5/10/12/17/25/35mm |
The iTL1208 thermal imaging module can be widely used in forest firefighting, power maintenance, photovoltaic inspection, security monitoring, wearable devices, portable devices, and more.
- Deep Technical Expertise - Many years of experience in infrared sensor technology research, development, and application with strong capabilities across chip design, wafer fabrication, packaging and testing, and system integration
- Focused on Innovation and Practical Implementation - Committed to driving technological breakthroughs in thermal imaging, constantly pushing boundaries in NETD, SWaP, and operating temperature
- Diversified Product Portfolio - Comprehensive range of infrared detection components including both cooled and uncooled solutions for various industries
- Rigorous Reliability Validation - Robust quality management system with multiple testing procedures throughout production to ensure long-term stability and reliability
- Professional Technical Support - Engineering team works closely with customers' R&D and product teams to accelerate system integration and improve efficiency
Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device that reacts to infrared radiation and thermal energy and converts it into electrical signals, then outputs visible thermal images.
WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package and ceramic package, they are the 3 main package formats of uncooled infrared detectors.
WLP IR detectors are specially designed to meet the miniaturization and low cost requirements in the application of infrared technology to consumer electronics market. Global Sensor Technology, with volume fabrication capability, is now offering a variety of WLP infrared module solutions to boost more new applications in emerging markets.

