Tiny Size 640x512 Resolution 12μm Pixel Pitch Uncooled Infrared Camera Core for Forest Firefighting

Place of Origin Wuhan, Hubei Province, China
Brand Name SensorMicro
Certification ISO9001:2015; RoHS; Reach
Model Number iTL612 Pro
Minimum Order Quantity 1 Piece
Price Negotiable
Payment Terms T/T
Product Details
Resolution 640x512 Power Consumption 0.5W
Spectral Range 8~14μm Pixel Pitch 12μm
Typical NETD ≤40mK Frame Rate 25/30Hz/50Hz
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12um Uncooled Infrared Camera Core

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640x512 Infrared Camera Core

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UAV Payloads Infrared Camera Core

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Product Description
640*512/12μm Uncooled Infrared Camera Core Tiny Size for Forest Firefighting
Product Overview

As a leading manufacturer of cooled and uncooled infrared detectors and thermal modules, SensorMicro has developed the iTL612Pro - a compact, lightweight infrared thermal imaging core. This advanced version builds upon the proven iTL612 platform with enhanced size and weight optimization.

Designed specifically for SWaP-C (size, weight, power, and cost) optimization, the iTL612 Pro infrared camera core sets industry standards for compact dimensions and minimal weight. It represents the ideal solution for integrators with strict size and weight requirements for their product designs.

Featuring a 640*512/12μm self-developed wafer-level infrared detector, IP67-rated lens protection, and comprehensive SDK solutions, the iTL612 Pro thermal module delivers exceptional performance in constrained spaces while achieving extended battery life through ultra-low power consumption.

Main Features
  • Unmatched Lightness and Minimal Load
    • Ultra-Miniature Size: 17.3*17.3*23.4 mm (including 9.1 mm lens)
    • Ultra-Lightweight: 13.7±0.5g (including 9.1 mm lens)
    • Ultra-Low Power Consumption: As low as 0.5W
  • Mainstream FPA with Clear Imaging
    • 640*512 Resolution for widespread integration
    • Enhanced Image Clarity: Multiple new-generation image algorithms for improved image quality
  • Easy Development & Seamless Integration
    • Multiple lens options available to suit various application scenarios
    • Supports multiple image output interfaces: DVP8, LVDS, MIPI, USB 2.0, and BT.656
    • RAW/YUV/Matrix-TEMP data output with serial port control
Product Specifications
Model iTL612Pro
IR Detectors Indicators
Sensitive Material VOx
Resolution 640*512
Pixel Size 12μm
Spectral Response 8μm ~ 14μm
Typical NETD ≤40mK
Image Processing
Digital Frame Rate 25/30Hz/50Hz
Start-up Time ≤5s
Digital Video RAW/YUV/Matrix-TEMP
Image Algorithm NUC/3DNR/DNS/DRC/EE
Image Display 10 (Black Hot/White Hot/Pseudo Color)
Electrical
Standard External Interface 30Pin_HRS interface: DF40C-30DP-0.4V(51)
MIPI External Interface 34Pin_Panasonic Connector Interface: AXE634124
Communication Interface TTL-232/USB2.0
Digital Video Interface DVP8/LVDS/MIPI/USB2.0/BT.656
Supply Voltage 4.2-5.5V
Typical Power Consumption 0.5W
Mechanical
Size (including lens) 17.3*17.3*23.4 (9.1mm lens)
17.3*17.3*30.2 (13mm lens)
17.3*17.3*38 (25mm lens)
17.3*17.3*54 (45mm lens)
Weight (including lens) 13.7±0.5g (9.1mm lens)
20±0.5g (13mm lens)
27.3±0.5g (25mm lens)
51±0.5g (45mm lens)
Environmental Adaptability
Operating Temperature -40℃~+70℃
Storage Temperature -45℃~+85℃
Humidity 5%~95%, non-condensing
Vibration Sine Vibration, Frequency: 10HZ~150HZ~10HZ, Peak Value: 0.15mm, Axial Direction: X, Endurance Time: 8min/axis, Cycles: 2 times
Impact Half Sine Wave, 30g/11ms, Impact Direction X Axis, 3 times
Certification ROHS2.0/REACH
Optical Lens Fixed Focus Athermal: 9.1/13/25/45mm
Industrial Applications

The iTL612 Pro thermal imaging module is designed for integration into various wearable devices and systems with strict size and weight requirements. It finds extensive application in:

  • Forest Firefighting
  • Power Maintenance
  • Photovoltaic Inspection
  • Security Monitoring
  • Wearable Devices
  • Portable Devices
Your Trusted Partner in Infrared Sensing
  • Deep Technical Expertise

    With many years of experience in research, development, and application of infrared sensor technology, we possess strong capabilities across chip design, wafer fabrication, packaging and testing, and system integration.

  • Focused on Innovation and Practical Implementation

    We drive technological breakthroughs in thermal imaging, constantly advancing NETD, SWaP, and operating temperature parameters to maintain leadership across security, industrial monitoring, and intelligent systems applications.

  • Diversified Product Portfolio

    Backed by independent R&D and multiple technical pathways, we offer comprehensive infrared detection solutions—both cooled and uncooled—tailored for diverse industrial applications.

  • Rigorous Reliability Validation

    Supported by robust quality management systems, our products undergo extensive testing throughout production to ensure long-term stability and reliability.

  • Professional Technical Support

    Our engineering teams collaborate closely with customer R&D and product teams to accelerate system integration, improve efficiency, and reduce time-to-market.

Frequently Asked Questions
How to choose proper infrared detector resolution?

Selection depends on actual application requirements and budget considerations. For applications where image quality is not critical, lower resolution detectors (120*90, 256*192, 400*300) may suffice. For applications requiring high clarity, such as remote monitoring, higher resolution detectors (1280*1024) are recommended.

How to select right pseudo color for thermal imaging?

• Gray-white palette: Ideal for targets with small temperature differences
• Red and blue palette: Suitable for identifying problem points in scenes
• Iron red palette: Standard color scheme for power industry applications
Note: Temperature measurements remain consistent regardless of color palette selection.

How to choose a suitable infrared thermal camera lens?

• Standard lens: Suitable for normal targets at appropriate distances
• Telephoto lens: Ideal for small targets viewed from long distances
• Wide angle lens: Provides more detail for objects at close distances
• Macro lens: Designed for very small targets at close range, such as chip circuits