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Thermal Camera Core
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Thermal Security Camera
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Plug-in Thermal Camera
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Cooled Infrared Detectors
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Cooled Camera Modules
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Optical Gas Imaging
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Radiometric Thermal Module
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High Resolution Thermal Camera Module
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Thermal Camera For Fever Detection
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Vehicle Mounted Thermal Camera
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Integrated Dewar Cooler Assembly
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Uncooled Infrared Detectors
384x288 Resolution 12μm Pixel Size Uncooled LWIR Thermal Imaging Module for Security Cameras
| Type | Uncooled Camera Module | Resolution | 384x288 / 12μm |
|---|---|---|---|
| Frame Rate | 25Hz/30Hz/50Hz | NETD | <30mK |
| Typical Power Consumption | <1.1W | Weight | ≤77g |
| Highlight | LWIR Thermal Imaging Security Camera,Uncooled Thermal Imaging Security Camera,400x300 Thermal Security Camera |
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The MICO412 ultra-compact infrared camera core features a 384×288 resolution infrared detector, multiple optical lens options, image processing board, and a robust structural frame. It transmits analog or digital video to backend platforms for integration. With larger array, the MICO412 meets various needs of different customers.
SensorMicro uncooled infrared detectors and thermal imaging modules can be widely used and integrated into security monitoring systems, including smart city road traffic monitoring, infrastructure monitoring, fire security in industrial areas, early fire detection, harbor protection, border security, perimeter surveillance, and maritime cruising.
- Low-cost and Energy-efficient Solution
- Equipped with self-developed 384×288/12μm wafer-level infrared detector, offering a clear cost advantage
- Integrated with a dedicated ASIC chip for high energy efficiency
- Optimized SWaP
- Ultra-compact size: only 22.2×22.2×27.2mm (excluding lens)
- Lightweight: just 30.3±2g
- Low power consumption: 680mW
- Easy Development & Quick Integration
- Provides native analog or digital video output, supporting CVBS/USB/MIPI standards—no additional development required
- Easy mounting with minimal structural design effort
| Model | MICO412 |
|---|---|
| IR Detector | Sensitive Material: VOx |
| Resolution: 384×288 | |
| Pixel Size: 12µm | |
| NETD: ≤30mK/F1.0/25℃ | |
| Spectral Response: 8~14μm | |
| Optical Lens | Focus/F#: 4.8/F1.0 | 9.1mm/F1.0 | 13mm/F1.0 |
| FOV: 51°(H)×39°(V) | 28.4°(H)×21.5°(V) | 20°(H)×15°(V) | |
| Detection Range (8 pixels) | 99m (5'11" tall person) |
| 360m (4m×3m vehicle) | |
| Type | Fixed Focus Athermal: First lens sealing/coating IP67 |
| Image Processing | Analog Video: PAL(default) / NTSC |
| Digital Video: USB/MIPI | |
| Frame Rate: 25Hz/30Hz/50Hz | |
| Start-up Time: ≤6s | |
| Image Algorithm: NUC/DRC/DNS/DDE/SFFC | |
| Pseudo Color | 11 types - customizable |
| Electrical Interface | Standard External Interface: 3PIN interface (A1251-WV-S-3P) | 9PIN interface(A1251-WV-S-9P) | 26PIN interface(DF56C-26S-0.3V-51) |
| Video Interface: CVBS | USB | MIPI | |
| Power Supply | Supply Voltage: DC: 5V~24V |
| Steady Power Consumption: ≤680mW@5V, 23±3℃ | |
| Mechanical | Dimension: 22.2mm×22.2mm×27.2mm (L×W×H) |
| Weight: 30.3±3g | |
| Environmental Adaptability | Operating Temperature: -40℃~+70℃ |
| Storage Temperature: -45℃~+85℃ | |
| Humidity: 5%~95%, non-condensing | |
| Vibration: Random Vibration, 5.35grms, 3-axis | |
| Impact: Half Sine Wave, 40g/11ms, 3 Axis, 6 Direction | |
| Certification | RoHS2.0/Reach |
The MICO412 thermal infrared camera module is suitable for long range monitoring systems and complex environments, including scarcely populated areas, 24/7 all weather monitoring, and harsh weather locations.
- Complete Documentation: Product manuals, setup guides, and selection references for immediate implementation
- Development & Testing Assistance: Sample integrated testing, performance evaluation, and parameter verification
- Advanced Developer Toolkit: SDKs, APIs, algorithms, and debugging tools for deep integration
- Remote Technical Support: 24/7 support with quick response and timely resolution for critical issues
- Warranty: Original parts and strict process adherence to restore optimal performance
Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device that reacts to infrared radiation and thermal energy and converts it into electrical signals, then outputs visible thermal images.
WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package and ceramic package, they are the three main package formats of uncooled infrared detectors.
WLP IR detectors are specially designed to meet the miniaturization and low cost requirements in the application of infrared technology to consumer electronics market. SensorMicro, with volume fabrication capability, offers a variety of WLP infrared module solutions to boost more new applications in emerging markets.

