640x512 Resolution 8μm Pixel Pitch LWIR Thermal Module Infrared Camera for Medical Imaging System

Our iHA608W adopts ApexCore 640×512 8μm top infrared sensor, specially made for non-contact biological temperature check with high accuracy of ±0.5°C. Equipped with medical image algorithms, it can generate sharp thermal images, show exact temperature distribution and supply stable temperature data. The 8μm small pixel makes the whole unit smaller and neater. It comes with Type-C video interface and USB2.0 communication port for easy & quick integration. Customers can apply this module to medical diagnosis, health screening, livestock temperature testing and many related industries.

• Precise Temperature Measurement & Exquisite Imaging
• Custom-designed for non-contact biological temperature measurement with high precision of ±0.5°C
• Matched with medical-grade lens and exclusive medical image processing algorithms for sharper thermal imaging
• Miniature Form Factor & Easy Assembly
• Built upon the 8μm ApexCore small-pixel infrared detector to realize an ultra-compact body structure
• Compact dimension of 21×21×31.5 mm and lightweight weight of 25±2 g, compatible with a wide range of miniature devices
• Rapid Integration & Hassle-Free Development
• Standardized Type-C and USB2.0 interfaces support faster system integration
• SDK resources available for Windows, Android and Linux platforms to lower overall development barriers

The iHA608W thermal module is expected to be widely used in the fields of Disease Screening, Traditional Chinese Medicine Physiotherapy, Health Check-up, Rehabilitation etc. at present and in the future.

• High sensitivity and excellent performance
• World-leading technology in infrared industry
• Various infrared detectors available
• Both uncooled and cooled IR detectors in different formats and pixel size
• Volume production to ensure fast delivery
• Three production lines with annual production capability up to millions of detectors

Metal packaging uses metal tube shell, thermoelectric cooler (TEC) and columnar getter. The TEC plays an important role of stabilizing the working temperature so that the infrared detector works at room temperature, thereby improving the ability of thermal imaging sensors to adapt to extreme environments, such as heavy fog, rain and snow etc.

But the disadvantage is that the cost is too high, accounting for more than 60% of the total cost of the entire uncooled products production, and causing a long production cycle. Such packaging method is for high-end applications.

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing. It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.