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Uncooled Infrared Detectors
Contact Person :
Wendy Wang
Phone Number :
+86 27 50185150
640x512 Resolution 12μm Pixel Pitch ≤25mK NETD Uncooled LWIR Thermal Imaging Module
Product Details
| Resolution | 640x512 | NETD | ≤25mK/F1.0/25℃ |
|---|---|---|---|
| Power Consumption | 0.65W | Spectral Range | 8~14μm |
| Pixel Pitch | 12μm | Digital Frame Rate | 25/30/50Hz |
| Highlight | Uncooled Sharp Clear Thermal Imaging Module,Thermal Imaging Module 8um,SWaP-C LWIR Thermal Camera Core |
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Product Description
SWaP-C Sharp Clear Thermal Imaging Module Uncooled LWIR 8~14μm
SWaP-C Uncooled LWIR 640x512 12 μm Thermal Imaging Module
The COIN612G2 thermal imaging core leverages a 640 × 512 resolution, 12μm pixel pitch ApexCore wafer-level microbolometer infrared focal plane array, augmented by dedicated signal processing circuitry and multi-stage image enhancement algorithms to realize a typical noise equivalent temperature difference (NETD) of ≤25mK, enabling reliable identification of subtle thermal gradients. Hardware communication layers comply with widely adopted serial bus protocols, while multi-channel video output modules support USB 2.0, DVP, LVDS and BT.656 transmission formats.
Operators and integrators can select from a full spectrum of matched infrared objective lenses to satisfy optical requirements across industrial inspection, security surveillance, field observation and AIoT sensing systems. Real-time hotspot extraction and high-fidelity thermal frame output minimize algorithmic and hardware adaptation work in secondary development, positioning COIN612G2 as a fully functional, cost-optimized off-the-shelf thermal integration unit.
Main Features
Full-Featured, Cost-Effective Imaging Subsystem
Wafer-level ApexCore detector delivers ≤25mK NETD; combined FPA and algorithm stack suppress image noise and improve target contrast
Wafer-level ApexCore detector delivers ≤25mK NETD; combined FPA and algorithm stack suppress image noise and improve target contrast
Minimal Form Factor, Low Power Dissipation
Size: 25.4mm × 25.4mm × 15.7mm; weight: 15±1g; typical power consumption 0.65w
Size: 25.4mm × 25.4mm × 15.7mm; weight: 15±1g; typical power consumption 0.65w
Modular Hardware for Streamlined Integration
Modular lens mounting system with multiple focal length options; multi-standard digital video outputs; configurable RAW/YUV pixel data with serial control interface
Modular lens mounting system with multiple focal length options; multi-standard digital video outputs; configurable RAW/YUV pixel data with serial control interface
Product Specifications
| Model | COIN612G2 |
|---|---|
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤25mK/F1.0/25℃ |
| Image Processing | |
| Digital Frame Rate | 25/30/50Hz |
| Start-up Time | 6s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV422 |
| Image Algorithm | Non-uniformity Correction (NUC) 3D Noise Reduction (3DNR) 2D Noise Suppression (DNS) Dynamic Range Compression (DRC) Edge Enhancement (EE) |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| PC Software | |
| ICC Software | Module Control & Video Display |
| Electrical | |
| Standard External Interface | 50pin: DF40C-50DP-0.4V(51), (HRS,Male) |
| Extension Board | USB3.0/USB2.0/VPC/USB2.0&VPC |
| Communication Interface | TTL-232/USB2.0 |
| Digital Video Interface | DVP8/DVP16/USB2.0/BT.656/LVDS |
| Supply Voltage | 4.5~5.5V |
| Typical Power Consumption | 0.65W |
| Mechanical | |
| Bare Core Size(mm) | 25.4×25.4×15.7 |
| Bare Core Weight(g) | 15±1g |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times |
| Certification | ROHS2.0/REACH |
| Optical Lens | |
| Optical Lens | Fixed Focus Athermal: 4.8mm/7mm/9.1mm/13mm/19mm/25mm/35mm/50mm/70mm |
| Protection Level | IP67(Front Lens) |
Industrial Applications
The COIN612G2 thermal imaging module is applied to the field of Thermography, Security Monitoring, UAV Payloads, Robots, Intelligent Hardware, ADAS, Firefighting & Rescue.
Thermography
Security & Monitoring
Firefighting & Rescue
UAVs Payload
Personal Vision
ADAS
AIoT
Other Applications
Customized Service
- Product Customization: Adjust configurations and adapt algorithms to meet industry-specific requirements
- On-Site Technical Support & Training: Provide core customers with hands-on system setup and operational training
- Joint Innovation for New Products & Markets: Collaborate with customers to co-develop innovative infrared application solutions
Frequently Asked Questions
In which industries can the infrared detectors/thermal camera cores be used?
Our infrared detectors / thermal camera cores are widely used in many industries such as:
- Thermography: Power Maintenance, Machine Vision, Building HVAC, Metallurgical Petrochemical, Predictive Maintenance, Epidemic Prevention
- Security & Monitoring: Safe City, Infrastructure Monitoring, Border Security, Maritime Cruising, Mining Safety
- Firefighting & Rescue: Forest Fire Prevention, Fire Prevention, Search & Rescue
- UAVs payload: Equipment Inspection, Enforcement & Rescue, Firefighting Application, Animal Observation
- Personal Vision: Outdoor Leisure, Animal Observation, Enforcement Patrol
- ADAS: Autonomous Driving, Advanced Driver Assistant System, Special Vehicles
- AIoT: Smart Home, Intelligent Hardware, Smart Care, Robots
- Others: Enhanced Flight Vision System, Gas Detection, Agriculture & Graziery, Scientific Research
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