Uncooled Thermal Camera Core with 384x288 Resolution and 17μm Pixel Pitch Longwave FPA VOx Thermal Module

COIN417G3 infrared camera core integrates 384x288 / 17μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.

The COIN417G3 infrared module features sharp and crisp thermal image presentation, compact size and low cost. We provide integrators with various mature and stable infrared thermal imaging solutions that are easily integrated into terminal products while significantly reducing costs.

• Comprehensive Functionality, Cost-Effective Design
  Developed using high cost-performance wafer-level packaging detector with advanced image processing algorithms
• Outstanding Performance, Superior Imaging
  High sensitivity with typical NETD≤30mK and next-generation image algorithms for clearer, sharper thermal images
• Flexible Extension, Rapid Integration
  Multiple optical lens options, supports USB2.0/DVP/LVDS/BT.656 interfaces, outputs RAW/YUV image data with serial port control

The COIN417G3 infrared camera core is widely used in Industrial Vision, Security Monitoring, Firefighting & Rescue, Outdoors, Machine Vision, ADAS and more.

• Rich Product Variety: Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.
• Outstanding Performance: Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.
• Easy Integration: Multiple interface options make integration straightforward and enable rapid development across multiple application fields.