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Uncooled Infrared Detectors
Contact Person :
Wendy Wang
Phone Number :
+86 27 50185150
LWIR Uncooled Thermal Module with 640x512 Resolution and 8μm Pixel Pitch for Medical Thermal Image Screening
Product Details
| Resolution | 640x512 | Power Consumption | 0.6W |
|---|---|---|---|
| Spectral Range | 8~14μm | Pixel Pitch | 8μm |
| Typical NETD | ≤30mK | Frame Rate | 25Hz |
| Highlight | Medical LWIR Uncooled Thermal Module,Uncooled Thermal Module 384x288,17um Thermal Image Camera Module |
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Product Description
LWIR Uncooled Thermal Module 640x512 8μm For Medical Thermal Image Screening
LWIR Uncooled Thermal Module 640x512 8 μm For Medical Thermal Image Screening
Product Description
Looking for high-performance uncooled infrared camera core for medical temperature taking? The iHA608W leverages ApexCore 640×512 8μm infrared detector, purpose-built for non-contact body temperature measurement with ±0.5-degree measurement precision. Custom medical image processing algorithms render fine-grained thermal visuals, mapping temperature distribution precisely and outputting stable temperature measurement data. Its 8-μm pixel size shrinks overall dimension and weight. Equipped with Type-C video and USB2.0 communication ports, the thermal core supports seamless integration. Common use cases cover medical diagnostic equipment, public-site health screening stations and livestock body temperature inspection.
Main Features
- High-precision Temperature Measurement & Vivid Thermal Imaging
- Purpose-engineered for non-contact human temperature detection, accuracy up to ±0.5°C
- Medical-quality optical lens paired with specialized medical algorithms for sharp thermal images
- Small-size Light-weight Embedded Thermal Core
- ApexCore 8μm infrared sensor enables miniaturized mechanical design
- Dimension 21×21×31.5mm, weight 25±2g, easy to fit inside mini medical devices
- User-friendly Integration & Multi-platform SDK
- Ready-to-use Type-C & USB 2.0 interfaces to speed-up system deployment
- Full SDK support: Windows, Android, Linux, reducing engineering development difficulty
Product Specifications
| Model | iHA608W |
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 640×512 |
| Pixel Size | 8μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤30mK |
| Image Processing | |
| Digital Frame Rate | 25Hz |
| Start-up Time | ≤6s |
| Digital Video | RAW/YUV/TMP |
| Image Algorithm | NUC/3DNR/DNS/DRC/EE |
| Image Display | Medical/Pseudo Color |
| PC Software | |
| Computer Software | Module Control & Video Display |
| Temperature Measurement | |
| Operating Temperature | 10℃~+50℃ |
| Temperature Measurement Range | 32℃~+42℃ |
| Temperature Measurement Accuracy | ≤±0.5℃ (after 2-minute warm-up, ambient 23±3°C, target 32-42°C) |
| Measurement Distance | 0.5m-5 m; supports multi-distance temperature measurement via SDK |
| SDK | Support Windows/Android/Linux SDK, Realize Video Stream Analysis, Module Control, Comprehensive Array Temperature Measurement, Temperature Imaging, Temperature Window Setting, Multiple Integration |
| Electrical | |
| Standard External Interface | USB(TYPE-C) |
| Communication Interface | USB |
| Digital Video Interface | USB2.0 |
| Supply Voltage | 5V±0.5 |
| Typical Power Consumption | 0.6W |
| Optical Lens | |
| Focus Length | 4mm |
| Type of Lens | Fixed Focus Athermal |
| F/# | 1 |
| FOV(H×V) | 69.2°×55.4° |
| Mechanical | |
| Size(including lens) | 21Mm×21mm×31.5mm(including 4mm lens) |
| Weight (including lens) | 25g±2(including 4mm lens) |
| Environmental Adaptability | |
| Operating Temperature | -10℃~+50℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction, 3 Axis, 6 Direction |
| ESD | 6kV contact discharge; 8kV air discharge |
| Certification | |
| Environmental Certification | ROHS2.0/REACH |
Industrial Applications
The iHA608W thermal module is expected to be widely used in the fields of Disease Screening, Traditional Chinese Medicine Physiotherapy, Health Check-up, Rehabilitation etc. at present and in the future.
Our Advantages
- Diversified Product Portfolio
- Deep Technical Expertise
- Rigorous Reliability Validation Ensures Quality Assurance
- Focused on Innovation and Practical Implementation in Infrared Sensing
- Professional Technical Support and Joint Development Services
FAQs
1. What is the difference between uncooled and cooled IR detectors?
There are currently two types of infrared thermal imaging sensors on the market, cooled and uncooled.
Uncooled IR detector operates at ambient temperature. It is based on semi-conductor industry and thus usually can be fabricated in big volume with small size and low cost. Uncooled IR detectors are widely used in portable/handheld/mobile devices.
Cooled IR detectors are packaged in a unit that keeps them at an extremely low temperature which shall be supported by a cryo cooler. They are much bigger, more expensive and less reliable than uncooled sensors, mainly due to the complex cooling systems they require. However, the cooled systems are incredibly sensitive and usually work with long focal length optics to achieve long range mission.
Uncooled IR detector operates at ambient temperature. It is based on semi-conductor industry and thus usually can be fabricated in big volume with small size and low cost. Uncooled IR detectors are widely used in portable/handheld/mobile devices.
Cooled IR detectors are packaged in a unit that keeps them at an extremely low temperature which shall be supported by a cryo cooler. They are much bigger, more expensive and less reliable than uncooled sensors, mainly due to the complex cooling systems they require. However, the cooled systems are incredibly sensitive and usually work with long focal length optics to achieve long range mission.
2. About Wafer Level Packaging Infrared Detector
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.
It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.
It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.
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