COIN Series Thermal Camera Module with LWIR Uncooled Infrared Detector 400x300 / 17μm

Place of Origin Wuhan, Hubei Province, China
Brand Name GST
Certification ISO9001:2015; RoHS; Reach
Model Number COIN417/R
Minimum Order Quantity 1 Piece
Price Negotiable
Payment Terms L/C, T/T

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Product Details
Technology Infrared Material Vanadium Oxide
Resolution 400x300/17μm NETD <40mK
Spectral Range 8~14μm Temperature Accuracy ±3℃ Or ±3%
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Product Description
COIN417/R Thermal Imaging Module

 

COIN Series Thermal Camera Module with LWIR Uncooled Infrared Detector 400x300 / 17μm

 

Product Description

 

COIN417/R is one of the COIN series uncooled infrared modules developed by Global Sensor Technology (GST). It integrates 400x300 / 17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm.

 

The COIN417/R infrared module features in sharp and crisp thermal image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.

 

Its lightweight and flexible features with various industry standard interfaces make it beneficial to OEM customers for secondary development and integration in all kinds of infrared thermal cameras.

 

 

Main Features

 

- Mini Size: 25.4x25.4x14.1mm

- Light Weight

- NETD<40mk

- High Quality Image

- Low Power Consumption

- Rapid Development & Integration

 

Product Specifications

 

Model COIN417/R
IR Detector Performance
Resolution 400x300
Pixel Pitch 17μm
Spectral Range 8~14μm
NETD <40mk
Image Processing
Frame Rate 25Hz/30Hz/50Hz/60Hz
Start-up Time ≤10s
Analog Video PAL/NTSC
Digital Video RAW/YUV/BT656
Dimming Mode Linear/Histogram/Mixed
Digital Zoom 1~8X Continual Zoom, Step Size 1/8
Image Display Black Hot/White Hot/Pseudo Color
Image Direction Horizontally/Vertically/Diagonally Flip
Image Algorithm NUC/AGC/IDE/DNR
Electrical Specification
Standard External Interface 30pin_HRS
Communication Mode RS232-TTL, 115200bps
Supply Voltage 3.5~5.5V
Typical Power Consumption <1.1W
Temperature Measurement
Operating Temperature Range -10°C~50°C
Temperature Measurement Range -20°C~150°C, 100°C~550°C
Temperature Accuracy ±3℃ or ±3% (Take the Maximum Value)
SDK Support ARM/Windows/Linux SDK, Full Screen Thermography
Physical Characteristics
Dimension (mm) 25.4x25.4x14.1 (With Shutter)
Weight 13g±0.5g (Without Lens)
Environmental Adaptation
Operation Temperature -40°C ~ +70°C
Storage Temperature -45°C ~ +85°C
Humidity 5%~95%, Non-condensing
Vibration Random Vibration 5.35grms, 3 Axis
Shock Half-sine Wave, 40g/11ms, 3 Axis 6 Direction
Optics
Optional Lens Fixed Focus Athermal: 9.7mm/15mm/19mm

 

Industrial Applications

 

The COIN417/R thermal imaging module is widely used in Thermography, Security & Monitoring, Outdoors, Firefighting & Rescue, AIoT, Intelligent Hardware, UAV Payloads, ADAS etc.

 

COIN Series Thermal Camera Module with LWIR Uncooled Infrared Detector 400x300 / 17μm 0

 

Our Product Line

 

COIN Series Thermal Camera Module with LWIR Uncooled Infrared Detector 400x300 / 17μm 1

 

FAQs

 

1. What is infrared detector / thermal imaging sensor?

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.

 

2. What is WLP?

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.

 

3. What's the advantage of WLP?

WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. Global Sensor Technology, with volume fabrication capability, is now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.